Fernando.Gottardo1: Created page with "== Process Control Data == ''See the linked Process Control Data page for process control data (etch rate, selectivity, etc. over time) for a selection of commonly used dry etches.'' == Dry Etching Tools/Materials Table == === Process Maturity Ranking === * `R6` - most mature process with regular calibrations recorded on SPC charts. * ... * `R1` - least mature — process has been run at least once. * `A` - process '''A'''llowed a..."

2026-10-25T23:11:53Z

Created page with "== Process Control Data == ''See the linked Process Control Data page for process control data (etch rate, selectivity, etc. over time) for a selection of commonly used dry etches.'' == Dry Etching Tools/Materials Table == === Process Maturity Ranking === * <code>R6</code> - most mature process with regular calibrations recorded on SPC charts. * ... * <code>R1</code> - least mature — process has been run at least once. * <code>A</code> - process '''A'''llowed a..."

New page

== Process Control Data ==

''See the linked [[Process Control Data]] page for process control data (etch rate, selectivity, etc. over time) for a selection of commonly used dry etches.''

== Dry Etching Tools/Materials Table ==

=== Process Maturity Ranking ===

* <code>R6</code> - most mature process with regular calibrations recorded on SPC charts.
* ...
* <code>R1</code> - least mature — process has been run at least once.
* <code>A</code> - process '''A'''llowed and materials available but never done.

''The Key/Legend for this table's <code>A...R6</code> values is at the [[#Process_Ranking_Table|bottom of the page]].''

{| class="wikitable" style="text-align:center; width:100%;"
|-
| colspan="6" style="background-color:#c8c8ca; font-size:150%; font-weight:bold; padding:10px;" | Dry Etching Recipes
|-
! rowspan="2" | '''Material'''
! colspan="1" style="background-color:#d9e1f2;" | '''[[RIE Etching Recipes|RIE Etching]]'''
! colspan="1" style="background-color:#e2efda;" | '''[[ICP Etching Recipes|ICP Etching]]'''
! colspan="2" style="background-color:#fce4d6;" | '''[[Other Dry Etching Recipes|Other Dry Etchers]]'''
! colspan="1" style="background-color:#fff2cc;" | '''[[UV Reactor Recipes|UV Etch]]'''
|-
! style="background-color:#d9e1f2;" | [[RIE Etching Recipes#Oxford_RIE|Oxford RIE]]
! style="background-color:#e2efda;" | [[ICP Etching Recipes#Oxford_ICP|Oxford ICP]]
! style="background-color:#fce4d6;" | [[Other Dry Etching Recipes#XeF2|XeF2 Etch]]
! style="background-color:#fce4d6;" | [[Other Dry Etching Recipes#VapourHF|Vapour HF Etch]]
! style="background-color:#fff2cc;" | [[UV Reactor Recipes#UVReactor|UV]]
|-
| style="text-align:left;" | '''Al''' || R2 || [[Media:SiO2 Recipe1.pdf|R1]] || || ||
|-
| style="text-align:left;" | '''Au''' || || || R3 || ||
|-
| style="text-align:left;" | '''Cr''' || R2 || R1 || || ||
|-
| style="text-align:left;" | '''Cu''' || || || R1 || ||
|-
| style="text-align:left;" | '''Ge''' || || R1 || R2 || ||
|-
| style="text-align:left;" | '''Ni''' || || || R3 || ||
|-
| style="text-align:left;" | '''Pt''' || || || R3 || ||
|-
| style="text-align:left;" | '''Si''' || || R6 || R3 || ||
|-
| style="text-align:left;" | '''Ti''' || || R1 || || ||
|-
| style="text-align:left;" | '''W''' || || R1 || || ||
|-
| style="text-align:left;" | '''Al2O3''' || || R3 || || ||
|-
| style="text-align:left;" | '''AlGaAs''' || R3 || R3 || || ||
|-
| style="text-align:left;" | '''AlGaN''' || || R2 || || ||
|-
| style="text-align:left;" | '''GaAs''' || R3 || R6 || || ||
|-
| style="text-align:left;" | '''GaN''' || R3 || R6 || || ||
|-
| style="text-align:left;" | '''InP''' || R3 || R6 || || R3 ||
|-
| style="text-align:left;" | '''ITO''' || R3 || || || ||
|-
| style="text-align:left;" | '''Photoresist & Organics''' || R3 || || || || R3
|-
| style="text-align:left;" | '''SiC''' || || R1 || || ||
|-
| style="text-align:left;" | '''SiN''' || || R3 || || ||
|-
| style="text-align:left;" | '''SiO2''' || || R6 || || R3 ||
|-
| style="text-align:left;" | '''SiOxNy''' || || R1 || || ||
|-
| style="text-align:left;" | '''TiO2''' || || || R1 || ||
|-
| style="text-align:left;" | '''ZnO''' || || || R1 || ||
|-
| style="text-align:left;" | '''ZrO2''' || || R1 || || ||
|-
! '''Material'''
! style="background-color:#d9e1f2;" | Oxford RIE
! style="background-color:#e2efda;" | Oxford ICP
! style="background-color:#fce4d6;" | XeF2 Etch
! style="background-color:#fce4d6;" | Vapour HF Etch
! style="background-color:#fff2cc;" | UV
|}

== Process Ranking Table ==

Processes in the table above are ranked by their ''Process Maturity Level'' as follows:

{| class="wikitable" style="width:70%;"
|-
! Process Level !! Description
|-
| <code>A</code> || Process '''A'''llowed and materials available but never done
|-
| <code>R1</code> || Process has been run at least once
|-
| <code>R2</code> || Process has been run and procedure is documented
|-
| <code>R3</code> || Process has been run, procedure is documented, and data is available
|-
| <code>R4</code> || Documented procedure with regular (≥4x per year) data — '''no''' in-situ control available
|-
| <code>R5</code> || Documented procedure with regular (≥4x per year) data — '''and''' in-situ control available
|-
| <code>R6</code> || Documented procedure with control charts/limits available — fully controlled process
|}

Dry Etch - Revision history