Lithography
This page lists all lithography tools available at the facility, including photolithography, electron beam lithography, nano 3D printing, and supporting equipment.
Electron Beam Lithography (EBL)
Raith EBPG5150
The Raith EBPG5150 is a 100 kV electron beam pattern generator offering sub-10 nm resolution capability. It is the primary tool for high-resolution and high-throughput EBL at the CMM facility (Hawken Engineering Building).
Key Specifications
| Parameter | Value |
|---|---|
| Accelerating voltage | 100 kV |
| Beam current range | 100 pA – 100 nA |
| Minimum feature size | <10 nm (resist-dependent) |
| Writing field | Up to 1 mm × 1 mm |
| Stage travel | 150 mm × 150 mm |
| Maximum substrate | 200 mm wafer |
| Pattern formats | GDSII, DXF, Raith native |
| Proximity correction | BEAMER (available on request) |
| Stitching accuracy | <15 nm (post-calibration) |
Typical resists: PMMA A4, ZEP520A, HSQ 6%, ma-N 2403, Bilayer PMMA A2/A4
Common workflows: Single-layer PMMA lift-off, bilayer PMMA undercut, ZEP hard mask etch, HSQ negative tone, Al Dolan bridge junctions (qubits)
Location: CMM EBL Facility, Hawken Engineering Building
Booking: Via RIMS. Training mandatory before unsupervised use.
Raith eLINE Plus
The Raith eLINE Plus is a 30 kV EBL and CD-SEM system primarily used for critical dimension measurement and pattern verification. EBL mode is available for prototyping and process development, though throughput is lower than the EBPG5150. Best suited for CD-SEM work and early-stage process development.
Key Specifications
| Parameter | Value |
|---|---|
| Accelerating voltage | 1 – 30 kV |
| Modes | EBL, CD-SEM, SEM imaging |
| Minimum feature (EBL) | ~50 nm (resist-dependent) |
| CD-SEM resolution | <3 nm |
| Writing field | Up to 800 µm × 800 µm |
| Maximum substrate | 150 mm wafer |
| Pattern formats | GDSII, Raith native |
| Detectors | SE, BSE, in-lens |
Note: Currently operated primarily in CD-SEM mode. EBL available by arrangement with facility manager. For high-resolution or production EBL, use the EBPG5150.
Typical resists (30 kV): PMMA A4, ZEP520A, ma-N 2403
Location: CMM EBL Facility, Hawken Engineering Building
Booking: Via RIMS.
| EBPG5150 | eLINE Plus | |
|---|---|---|
| Voltage | 100 kV | 30 kV |
| Min. feature | <10 nm | ~50 nm |
| Throughput | High | Lower |
| CD-SEM | No | Yes |
Photolithography
SUSS MicroTec MA/BA6 Gen4 Mask Aligner
A semi-automated mask aligner for high-precision photolithography. Supports top-side, bottom-side, and infrared (IR) alignment for complex multilayer and backside processing. Processes wafers from 2" to 6" diameter.
Key Specifications
- Alignment accuracy: ±0.5 µm (top-side), ±1 µm (backside)
- UV illumination: G-, H-, and I-lines (350–450 nm), LED-based
- Wafer sizes: 2" to 6" (up to 10 mm thick)
- Exposure modes: Soft, hard, vacuum contact, and proximity (gap down to 1 µm)
- IR alignment for GaAs, InP, silicon and other IR-transparent materials
- Supports thick resists including SU-8 and dry film
Examples of use: MEMS/NEMS, microfluidics, photonics, semiconductor research, sensors
Location: Class 1000 cleanroom, Level 2E, AIBN (Bldg #75), UQ St Lucia
Contact: Dr Shuvashis Dey
Maskless Aligner – MLA150 (Heidelberg)
A high-speed direct-write photolithography system that eliminates the need for photomasks by writing patterns directly from CAD files onto photoresist-coated substrates using a laser.
Key Specifications
- Minimum feature size: ~1 µm (process-dependent)
- Laser wavelengths: 375 nm and 405 nm
- Frontside and backside alignment
- Direct CAD-to-substrate workflow
Examples of use: MEMS, microfluidics, micro-optics, photonics, sensor development, mask fabrication
Location: Class 1000 cleanroom, Level 2E, AIBN (Bldg #75), UQ St Lucia
Contact: Dr Jaber Saghaei
Direct Write Laser System – Heidelberg µPG101
Used to write photolithography chrome masks with a maximum resolution of 2 µm. ANFF-Q writes, develops, etches, cleans, inspects, and ships masks on request.
Key Specifications
- Mode 1: Write area 90 mm × 90 mm, resolution 2 µm
- Mode 2: Write area 125 mm × 150 mm, resolution 5 µm
- Compatible with 5" and 7" chrome masks
Examples of use: MEMS, bio-MEMS, integrated optics, microfluidics, sensors, graphene
Location: Class 1000 cleanroom, Level 2E, AIBN (Bldg #75), UQ St Lucia
Contact: Dr Jane Li
Lithography Suite (Griffith University)
Full industrial-standard photolithography process flow for micron-scale features: priming, coating, softbake, exposing, developing, and hardbake. Optimised for 150 mm wafers but supports smaller wafers and fragments.
Specifications:
- Resist uniformity: <±0.5% for 150 mm wafer
- Achieved resolution: 1 µm lines and spaces (86° profile)
Location: Cleanroom, QMF (Bldg N74), Griffith University Nathan Campus
Contact: Pradip Singha
Photolithography Streams (UQ AIBN)
Four separate streams are available in the ANFF-Q cleanroom, each with dedicated equipment (spin coater, hotplate, EVG620 mask aligner):
| Stream | Resists | Typical Use |
|---|---|---|
| AZ Stream | AZ12XT, AZ nLOF 2020, AZ40XT, AZ 1500 Series | Metal lift-off, dry/wet etch masking |
| SU8 Stream | SU8 2000, SU8 3000 series | Microfluidic moulds for soft lithography |
| Dry Film Stream | ADEX and SUEX dry films (DJ Microlaminates) | Thick patterned structures, microfluidics |
| Novel Stream | User-defined (consult staff) | Polymer coating and custom resists |
Location: Class 10000 and Class 1000 cleanrooms, Level 2E, AIBN (Bldg #75), UQ St Lucia
Nano 3D Printing
Nanoscribe Photonic Professional GT
A two-photon lithography system for fabricating micro- and nano-scale 3D structures with a minimum voxel size of 100 nm × 350 nm.
Specifications: Minimum voxel: 100 nm × 350 nm; substrates from coverslips up to 4" wafer and 5" square masks
Examples of use: Photonic crystals, 3D projections, microfluidics, cell scaffolds, bio-mimicry
Location: Class 10000 cleanroom, Level 2E, AIBN (Bldg #75), UQ St Lucia
Contact: Dr Jane Li
MPO100 (Multi-Photon 3D Printer)
A high-end multi-photon 3D printer combining two-photon polymerisation resolution with microfabrication scalability. Capable of producing structures from nanoscale to millimetre scale with submicron precision.
Specifications: Minimum feature size ~100 nm; substrates from coverslips up to 4" wafers and centimetre-scale parts
Examples of use: Micro-optics, diffractive optical elements, microlenses, biomedical scaffolds, microfluidic components
Location: Class 10000 cleanroom, Level 2E, AIBN (Bldg #75), UQ St Lucia
Contact: Dr Jane Li
Ultimaker 2 Extended+ (FFF 3D Printer)
A desktop fused filament fabrication (FFF) 3D printer for rapid prototyping and part design.
Specifications: Build volume 223 × 223 × 305 mm; layer thickness 20–600 µm; lateral resolution 150–800 µm
Materials: PLA, ABS, CPE, CPE+, PC, Nylon, TPU 95A
Location: PC2 Lab, Level 2E, AIBN (Bldg #75), UQ St Lucia
Supporting Equipment
HMDS Oven (YES LP-III)
Vapour-phase HMDS deposition for improving photoresist adhesion on silicon and glass substrates. Includes dehydration bake at 150 °C. Not effective with SU-8 (use Ti Prime instead).
Location: Class 10000 cleanroom, Level 2E, AIBN (Bldg #75), UQ St Lucia — Contact: Dr Jaber Saghaei
Hot Embosser (EVG520IS)
Semi-automated hot embossing and wafer bonding system. Handles wafers up to 150 mm. Also supports anodic bonding (Pyrex to silicon), fusion bonding, and nanoimprint lithography.
Specifications: Max temperature 650 °C, max force 60 kN, vacuum to 10⁻³ mbar, anodic bonding power supply 0–2000 V/50 mA
Location: Class 1000 cleanroom, Level 2E, AIBN (Bldg #75), UQ St Lucia — Contact: Dr Jaber Saghaei
Oxygen Plasma Cleaner (Harrick PDC-001/002)
Nanoscale surface cleaning and activation using oxygen plasma (10–30 W). Compatible with silicon, glass, PDMS and similar materials up to 4" substrate.
Location: PC2 Laboratory, Level 2E, AIBN (Bldg #75), UQ St Lucia — Contact: Dr Shuvashis Dey
Tergeo Plasma Cleaner
Surface activation and cleaning using oxygen and nitrogen plasma up to 75 W. Suitable for PDMS, glass, silicon, plastics, and metals up to 4" substrate.
Location: Class 10000 cleanroom, Level 3, Pandanus (Bldg #1022), Long Pocket — Contact: Dr Shuvashis Dey
UV–Ozone Cleaner (MBRAUN MB-UV-O3)
UV ozone cleaning for semiconductor and optical surfaces. Removes organic and carbon contamination. Wavelengths: 184.9 nm and 253.7 nm. Substrate size up to 150 mm × 150 mm.
Location: Room 910, Level 9, COPE (Bldg #68), UQ St Lucia — Contact: Ravi Chandra Raju Nagiri
Spin Coaters
Two spin coaters available: APT Polos (PDMS) and Brewer Science CEE 200X (SU8). Handles wafer sizes from 10 mm to 150 mm (6").
Location: Class 10000 cleanroom, Level 3, Pandanus (Bldg #1022), Long Pocket — Contact: Dr Shuvashis Dey
