Photonics

Photonics — Si photonics, metalenses, integrated photonics

Nanofabrication workflows for integrated photonic devices.

Si Photonics (waveguides, rings)

Silicon photonics — waveguides, ring resonators, grating couplers

EBL-defined silicon-on-insulator (SOI) waveguide devices. Critical dimensions typically 200–500 nm width.

Step 1 — Substrate prep and resist coating Clean SOI wafer in plasma cleaner. Spin ZEP520A or HSQ 6%. CMM — Diener plasma cleaner CMM — CEE Apogee spin coater Step 2 — EBL exposure Expose waveguide layout at 100 kV. Typical dose: 160–200 µC/cm². EBPG5150 (100 kV) Adding a pdf process flow SiCOI litho eLINE Plus (CD-SEM)

Facilities used CMM (Hawken) — EBL + metro ANFF-Q (AIBN) — etch / dep. Key instruments Raith EBPG5150 eLINE Plus Oxford RIE / Prog 200 Typical resists ZEP520A — positive tone HSQ 6% — negative tone hard mask

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